A process is described for trimming photoresist patterns during the fabrication of integrated circuits for semiconductor devices and MEMS devices. A first flexible membrane is formed on at least a portion of the front surface of the semiconductor substrate and extends over the first opening. The pump control circuit also includes an output power stage coupled to receive a control signal from the microcontroller and capable of controlling the application of current to the pump in response to the control signal in order to stabilize the temperature of the pump. In this manner, the host device and the storage devices can accomplish inputoutput transactions despite the fact that they implement different interface protocols.