A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. A prime motivation is concern about the dependency of existing concepts for dynamic provisioning on the real-time coherence of databases of network state at diverse geographic locations. In addition, there is a light source situated such that a portion of the pendulum assembly emits light. Another embodiment uses both pen up and pen down information to dynamically time warp-fit the information to fit it to a template. A method of manufacturing the fluid-filled vibration-damping device is also disclosed.