The present disclosure provides a semiconductor device comprising a substrate, an undoped HfO2 layer formed over the substrate and a TiN layer formed on the HfO2 layer. The connector interface system includes an interface and a protocol in communication with which allows a media player to communicate with external devices over a transport link. Openings in the base receive the heat pipes to support the lighting modules in a desired orientation, enabling location specific customized orientation. The remaining portion of the reactor effluent is passed downstream for further processing or handling. An extensible-retractable spring connected between the rocker links baises the upper end of the back link toward the lower end of the front link. The device allows far easier metrology and storage of CMP polishing pads at different stages of use with no damage to the CMP pad, which may be put back into service at any time.