The invention provides an apparatus for electromagnetically affecting a particle of interest in a specimen. The down-hole tool guide or ball guide assembly, being adaptive to the down-hole tools, extends forwardly there from and includes an eccentric rotatable ball and high-pressure jets. In one method, a silicon dioxide dielectric layer is provided upon an etch stop layer, wherein the etch stop layer comprises silicon dioxide that is doped differently from the silicon dioxide dielectric layer. Inner leads are provided in the resist opening and have portions that extend in a direction oblique to the perimeter.