A superconducting junction element has a lower electrode formed by a superconductor layer, a barrier layer provided on a portion of a surface of the lower electrode, an upper electrode formed by a superconductor and covering the barrier layer, and a superconducting junction formed by the lower electrode, the barrier layer and the upper electrode. The structure implements most common DSP equations in a fast and a highly compact manner. Charged powder is then electrostatically deposited into or onto unit dose package substrates as these packages are sequentially moved through the deposition region.