An inorganic solder mask for use as a surface treatment in masking a connection conductor of a semiconductor chip package against solder wetting when mounting the chip package to a printed wiring board or other substrate. The ECRV can be used to convert a non-zoned HVAC system into a zoned system. The first photoresist layer is patterned to develop pre-code openings over all of the memory cells, which correspond to intersecting word and bit lines.