An integrated detection system that includes a first threat detection apparatus and a second threat detection apparatus is provided. A stopper layer, an interlayer insulating layer, and a hard mask layer are sequentially formed on a semiconductor substrate having a conductive layer. No matter whether the end of the cable before preparation is at the crest or valley of the outer conductor, the tool provides the correct trim dimensions for each component and stops cutting when these dimensions are reached. Either the thermal bridge or a second thermal bridge element may be adapted to cool the internal container.