An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon substrate. The compositions include daptomycin or a pharmaceutically acceptable salt thereof at a concentration of less than or equal to about 25 mgmL, a buffer having an acidic functional group and have a pH of from about 6. A first electrode may substantially cover the mesa and have a plurality of pads disposed thereon maximizing a contact area in relation to the first electrode. A portion of the second intermediate layer can be disposed between the second layer and the first intermediate layer. A bag providing apparatus can be supplied either to the individual picker in the field or to the region near the entry to the pneumatic tube.