A system and method for manufacturing micro cavity packaging enclosure at the wafer level using MEMS process, wherein micro cavities are formed from epoxy-bonded single-crystalline silicon wafer as its cap, epoxy and deposited metal or insulator as at least part of its sidewall, on substrate wafers. If the predetermined function is selected for the printing process, the second printing apparatus prints the number of copies including the copy interrupted in the first machine according to the print setting. An input module is located in the base and the frame body, having a closed position and an uncovered position with respect to the base, is pivotally connected to the base.