A memory device array with spaced apart parallel isolation regions formed in a semiconductor substrate, with an active region between each pair of adjacent isolation regions. A method includes designing a product using a model from an initial test site. The relatively large inner surface achieved as a result improves the adhesion between the noble metal layer and the insulation layer. As the articles are being subjected to a centripetal force, the surface is heated by the radiant heat source. When the locking device is wedged into an opening in the yoke, the rope is cinched between the locking device and the yoke to lock the rope in place.