The present invention provides a method for inspecting a connecting surface of a flip chip to solve problems that the grinding, polishing and chemical etching method is used for making a sample. A \u201cfirst\u201d step\u2014though the steps are not necessarily executed in sequential order\u2014includes identifying as related data expressly satisfying the criteria. The location members are physically separated from one another, and further disposed around the respective corners of the combined contact regions to receive and hold an IC package in position. The distance along the recessed surface between adjacent shapes is at least 0.