Defect analysis of an integrated circuit die having an internal heat source is enhanced using a method and system that use the internal heat source to heat the die. In some embodiments, one or more vectors may be generated. They can adapt to severity of threats, weather, andor other situational aspects. The two layers are then sealed together across the open mouths to close the chambers and retain the gas in them. The global index is then passed to each sub-collection and is used by each during searching and retrieving of data information.