Recurrent conditional random field embodiments are described. wherein R1\u02dcR6 are as defined in the specification. The fixing includes fixing the protruding portion of the lens member to the piece of high-melting-point glass via surface tension generated by melting the piece of low-melting-point glass. Alternatively, a semiconductor chip comprises a testing pad and a bond pad respectively exposed by two openings in a passivation layer, wherein the testing pad is connected to the bond pad.