The present invention is a method an apparatus for diagnosing short defects on inaccessible or non-contacted nodes of an integrated circuit device using capacitive coupling techniques. The siding panel has at least one protrusion disposed along at least one of the faces, wherein the at least one protrusion provides an air gap between the siding panel and a face of a second siding panel when the siding panels are installed in a siding panel assembly. Cards are placed into all or some of the compartments in the box, and a shuffling sequence is then commenced.