A package containing a stack of wet wipes moistened with aqueous lotion is disclosed. An embodiment of the present invention also provides a method and apparatus that effectuates testing access, directly to the internal die component of the surface mount package or to a particular circuit node or conductive trace locale of the surface mount package, enabling performance evaluation and system debugging. The receiver determines an objective function that is based on the CQI and the performance measure, and selects a value for the CQI by performing an optimization technique on the objective function.