A wafer chuck is configured to hold a wafer efficiently for spin process cleaning of wafer edges and back sides. The sensitive information is split into several chunks, which are meaningless when taken alone. A pattern is next applied to the solid line to render a patterned line by use of a filtering mechanism that filters out pixels that correspond to off-segments of the pattern. The electrode plates on the surfaces of the carrier boards are opposite to each other across the high dielectric constant material layer to constitute a capacitor array. At least one of the first and second substrate supporters includes an electro static chuck including more than two of electrodes having different polarities and a polarity inverting unit for inverting polarities of the electrodes. The example method also etches an upper part of the tungsten layer in the trench portion to form a tungsten plug that occupies a lower part of the tungsten layer in the trench portion and the contact hole portion, deposits a Cu diffusion barrier on the tungsten plug, and deposits a Cu on the Cu diffusion barrier.