A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. One process includes operations for determining a hosted service for use with an application at a client based on user context data associated with the application. The workpiece support structure includes a rotation member rotatably affixed to the implantation chamber. The method includes accessing the electronic form based on the metadata for the electronic form from a content repository.