A flip-chip package board having signal bump pads, power bump pads and ground bump pads grouped together into respective inner bump pad rows and sequentially laid down on one side of the group of core bump pads so that the power bump pad row and the ground bump pad row alternate between signal bump pad rows. A pump control ring is moveable within the pump chamber to alter the capacity of the pump. The movement of the sensor relative to the reference plane facilitates the movement of one or more actuation balls of respective switches of the sensor, which in turn results in the generation of differing conditions or output signals corresponding to the particular pattern of electrical or conductive connection between a pad and terminals of the sensor facilitated by the switches thereof. The database server does not aggregate within these certain groups when performing aggregation in the current evaluation phase, thereby avoiding the duplication of work already performed during previous evaluation phases. Thus, safety and reliability of mounting of the lamp on the lamp holder can be increased. The elongated supporting portion has pads on an upper end, of which the outer sides taper off towards an upper end.