Provided is to secure a data-writing period to a source line and reduce the number of the IC chips used. The module includes a plurality of elongated hollow fiber membranes located generally in adjacent, parallel relationship to each other. The method also includes selectively providing a network address to a second computing device based on whether a second addressing system is present on the network. Wire bonds are formed between lead ends of each of the lead fingers to corresponding bond pads on the first and second dice for electrical connection therebetween.