A method for separating chips from a diamond wafer comprising a substrate, a chemically vapor-deposited diamond layer, and microelectronic elements, with the microelectronic elements protected from thermal damage and degradation caused by the thermally decomposed cuttings produced during the processing steps. Reserved inner tags are used to identify particular services. A pipe channel is provided in the toothbrush bar, the toothpaste container is communicated with the toothbrush head through the pipe channel via a valve. The lighting unit is also operable to optionally report usage information for the lighting unit using the light source to produce a visually undetectable information signal. The stop is located within the range of motion of the second arm such that the second arm bears against the stop when the stepping member is in the extended position. The minimal affected space required to receive the subject injection nozzle allows a single extruder die assembly to have more than one supply port fashioned therein.