A method of forming a lead-free solder alloy on an electronic substrate. A coupling condition monitoring system includes one or two electronic control units, sensors for sensing a coupling condition of the electronic andor hydraulic connection, and a sensor on the mechanical coupling for generating a signal representing a coupling condition of the mechanical coupling. The active components of the cells include two electrodes and an electrolyte layer that is maintained out of contact with at least one of the electrodes for interrupting an ionically conductive pathway between the electrodes. The adjusted blood pressure estimates calculated by the NIBP monitoring system can be calculated using different adjustment techniques and methods and are displayed on the NIBP monitor.