A contactless measuring system having at least one test probe forming part of a coupling structure for the contactless decoupling of a signal running on a signal waveguide, wherein the signal waveguide is designed as a conductor of the electric circuit on a circuit board and as part of an electric circuit. A pair of slide links extend and are slidable in a direction in which the image forming sections are aligned. The MEMS die is disposed on the base and over the opening.