A pliable combined support for decorative lighting comprises a receiver light mount having a light retaining notch and an insert light mount having a light retaining notch. Inlays are inserted within a planar sputter target in the shape of wedges, wires, or buttons to achieve uniform deposition of films on semiconductor substrates during sputtering. Contractual activities are executed through user interfaces developed by the parameters in the contract and are executed through the contract, which automatically inserts values from the terms and conditions of the contract. The second semiconductor layer may be grown separately under conditions different from those for forming the first semiconductor layer, and may be subsequently bonded to the first semiconductor layer.