In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The system is repairable because the elements connect together using re-workable flip chip connectors; each flip chip connector comprises a conductive spring element on one side and a corresponding well filled with solder on the other side. The components in the electronic viewfinder are arranged sequentially between the observer and the image.