In a manufacturing method for a semiconductor device, a main body wafer is formed, and a monitor wafer on which a monitor element is formed is provided. or higher and applying the resultant aqueous solution onto the semiconductor substrate to etch at least a part of the silicon film. In one of the selected applications, the single ASIC multi-protocol networking processor is employed in conjunction with other optical and electro components to form an integral optical networking module in support of optical-electro networking for the datacomtelecom protocols. A lead pitch p, the lead width w and lead thickness t of the inner lead tips connected to the semiconductor chip have the relations of w<t and p1. The instrument is such that when the remotely controllable user interface operates a first drive member, the first actuation advances a cutting member a first distance, wherein, when the remotely controllable user interface operates a second drive member, the other actuation retracts the cutting member a second distance, and wherein the second distance is greater than the first distance. The apparatus includes a homogeneous solid spherical test phantom which has the average electrical properties of human tissue and at a defined distance from the surface contains a dipole probe which is positioned in such a way that the derived probe signal is proportional to the average SAR for 1 g or 10 g of tissue.