1459854528-2ca4369c-ee9f-4b67-a935-224cc36b0508

A process for manufacturing an IC card includes a step of forming a plane coil by etching or punching a thin metal plate so that the plane coil consists of a conductor line wound as several loops in substantially the same plane and has respective terminals. In one embodiment, complex weightings for matching a polarization of an incident signal on a data channel are determined, and the complex weightings are applied to a tracking channel such that an antenna system polarization is matched to the polarization of the incident signal. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. A cooling jacket may be provided for cooling the tube, since the reaction between F2 and H2 is exothermic. Also included is a number-of-gray-scale-level determining unit which changes a number of gray scale levels for the respective areas of the image in response to the determination by the importance computation unit. It is especially applicable in the maintenance of metal equipment of nuclear installations, in particular equipment that is for irradiated nuclear fuel reprocessing.