The present disclosure provides a one-piece plastic container having a body defining a generally rectangular horizontal cross-section, and including a first pair of opposing sidewalls and a second pair of opposing sidewalls. Upon assembly of the semiconductor device component face-down upon a higher level substrate and establishing electrical communication between the semiconductor device component and the higher level substrate, the insulative spacers define a minimum, substantially uniform distance between the semiconductor device component and the higher level substrate. and an end boiling point of at least 1000\xb0 F. A valve assembly controls the flow of reformate to the adsorbent beds based upon sensed product data generated by a product sensor.