The present invention relates to leads of a No-Lead type package which includes a chip having an active surface and a rear surface opposite the active surface. Consequently, it shortens a reaching distance of electromagnetic waves and lessens its change, thereby making it easy to keep a stable receiving sensitivity state. The converted signals are transmitted to a remote device, such as a meter or a valve, by means of a packet-switching network. A robotic part removal device is used to remove the molded bumper fascia from the mold cavity after mold opening. The distributor and its active coupler may be located proximate a midpoint of the waveguiding plate.