A semiconductor device is made by mounting a semiconductor wafer to a temporary carrier. A plurality of through holes extend from the first surface to an opposite, second, surface. The power supply circuit is a charge pump-type power supply circuit, is made of a polycrystalline silicon semiconductor, and is a built-in circuit integrally formed on an insulating substrate. In various embodiments, gas or liquid may be used to open the container. The method is generally accomplished by first absorbing an anchor ligand onto the titanium dioxide semiconductor material, then adding an appropriate transition metal, and finally adding one or more secondary ligands to complete the synthesis of the transition metal complex or sensitizer. The system may be used to test interactive applications or non-interactive applications.