A semiconductor component includes a semiconductor substrate having a substrate contact, and a through wire interconnect bonded to the substrate contact. Packets judged to be \u201cstored\u201d are stored into a packet storage FIFO buffer 520 and sent out within a transmission bandwidth greater than the total sum of user-by-user minimum bandwidths. To this end diaphragm vibrations are detected by means of a microphone which is positioned directly in front of the diaphragm of at least one loud-speaker at the second face-end of the hollow chamber. With this arrangement, it is possible to compensate the delay of the transmission delay time and display the images at a timing synchronized with the timing of outputting the sounds.