A structure and method of handling a device wafer during through-silicon via processing are described in which a device wafer is bonded to a temporary support substrate with a permanent thermosetting material. In some embodiments, the second structure may comprise an internally-threaded nut. During vehicle launch from neutral idle operation, two different strategies may be employed to control engine idle speed. The gate electrodes intersect the active pillars, extend from the memory cell region to the contact region and are stacked on the semiconductor substrate.