A technique for receiving an error state in a single chip sequence in a wireless communications network is disclosed. A semiconductor multiplication layer is positioned between the two contact areas and a semiconductor absorption layer is positioned between the multiplication layer and the upper contact layer. The first structure may extend from one of the electrodes, and the second structure may extend from the other of the electrodes. The video communication service is provided with consideration of the control variable. High tolerance to Black Spot and Powdery Mildew is displayed.