A multi-layered polishing pad for modifying a surface of a workpiece, such as a semiconductor wafer, that reduces the effort, time and cost involved with pad replacement. The evaluation board includes a socket configured to receive a medical monitoring module and a plurality of connections for connection to a host or host simulator and a second device. In preferred aspects, the latching cover can be releasably secured to the clip body and can prevent the clip body from being withdrawn from the tip of a wiper blade during a secured state. Friction material can be located in the countersunk portion to further secure the cargo. Matching all of the symbols in the second game area before the third game area may result in the winning of a prize. The system provides an underlying component architecture having an object-oriented database structure and a metadata database structure which stores only one instance of each object while linking the object to multiple collections and domains for grouping into and retrieval from any of the collections.