An interconnect assembly includes a number of interconnects combined in a preferably planar dielectric carrier frame having resilient portions acting as spring members in conjunction with their respective interconnect’s rotational displacement during operational contacting. The pore size, usually between approximately 100 and 300 microns, allows vascular and connective tissue ingrowth throughout approximately 10 to 90% of the matrix following implantation, and the injection of cells uniformly throughout the implanted matrix without damage to the cells or patient. The data provided may then be rated. The housing 41 has a hood part 43 that covers the peripheries of the tabs 12 and 22 for the device and is fitted to a connector attaching hole 6 of the device 3 and the fuse 31 is attached to an accommodating space 45 in the hood part 43.