An interconnect formed using a stiff layer having a plurality of holes extending there through. The connecting assembly includes an elastic section that is compressed upon connection of the upper and lower rod members and elastically recovers to its original shape when the upper and lower rod members are separated. For example the methods disclosed permit the production of 2,9- and 2,10-disubstituted pentacene compounds and 2,6,9,13- and 2,6,10,13-tetrasubstituted compounds that present particularly advantageous properties for the manufacture of semiconductor materials, and may be used in devices such as for example thin film transistors and solar cells. The technique may further include selecting a segment from the utterance having at least Q contiguous matching aligned words, and training the incremental acoustic model with the selected segment. A fixation system with improved rigidity is also provided by way of independent clamping members for each of a pair of rod mounts on each pin positioner.