Embodiments disclosed herein provide a system and method for associating data records in multiple languages within a single hub. The wafer bonding apparatus places a plurality of wafers to be bonded between an upper unit and a lower unit, and bonds the wafers by applying pressure and heat by the upper unit and the lower unit. Thereafter, the registration mark is read from the back side by use of red light or near infrared rays, and registration of the stepper is accomplished.