One embodiment of the present invention concerns an integrated circuit that includes bond pads and special contact pads or points. The front portion comprises first and second loop padding. The engaging element engages the obstruction and moves the obstruction into the capture element. Conventionally, internal buses such as ones which connect the channel interface section to the shared memory section, and the disk interface section to the shared memory section, have been mounted on one platter, and the channel interface and other packages have been mounted thereon. The V-MSC then performs the GMSC functionality, for example, for that particular call.