The present invention relates to a copper plating solution for relieving the deposit stress of an electroplated copper film. The PY peptides of the present invention may be useful in regulating central and peripheral nervous and endocrine systems. Therefore, when random access data is transmitted between the UE and the NodeB, the NodeB can determine the UE from which the data is received, thus ensuring practicability of the transmission solution that uses High Speed Uplink Packet Access to implement random access. The film is then formed on the textured surface of the adhesion layer.