A semiconductor device is provided that can perform simultaneous writing of a large number of bits, without an increase in chip size. Locking the linkage assembly, however, can create significant loads on the linkage assembly. The abrasive elements of the conditioner may be degraded or dissolved in at least one chemical that will not substantially degrade or dissolve a material of the polishing pad. The recovery module retrieves a privately held undo log data through the authorized assumption of the failure identity associated with the failed first computer, backs out in-flight transaction updates of the first computer, and frees up data resources locked by the first computer.