A device for packaging andor applying a cosmetic or care product includes a hollow body forming a housing for the product, a base adapted to support the product and a driving arrangement or means for moving the base in translation so as to vary the volume of the housing. In one embodiment, the polishing head includes a carrier head assembly, and a retaining ring having a surface positionable adjacent a polishing pad and couplable to the carrier head assembly and configured to retain a semiconductor wafer therein, the retaining ring having a slurry conduit located therethrough to provide a flow of slurry to the polishing pad. At least one robot may move along the conveyor on the guide rail, the robot having a first axis for joint rotation of at least one moving member of the robot in relation to a main body guided along the guide rail. An elastic coefficient of the conductive material portion is lower than that of the solder resist.