A structure of flip chip package with an area bump has at least a chip, a substrate, a plurality of first bumps and at least a second bump, wherein the first bumps are electrically and mechanically connected to one of first bonding pads and the corresponding one of first contact pads. The contemplated device employs pneumatic force for lifting and blowing the floated matter into an inlet channel. A first operation in the set of operations associated with the contract is mapped to a policy rule event associated with at least one policy rule.