In a method of fabricating a semiconductor device, a first mask pattern is formed on a substrate. The hand tool further has a jaw portion first pivot point coupling the first hand tool member assembly to the second hand tool member assembly and a jaw portion second pivot point coupling the first hand tool member assembly to the second member assembly. The centerpiece is mounted to the base. In power receiving port, pullout hole is provided at a position where a distance between the pullout hole and a joint openably combining a lid with power receiving port is more than a distance between the inlet and the joint. In one embodiment, a resistor includes a doped body within a substrate; a trapped charge region adjacent to the resistor, the resistance of the resistor controlled by an amount of trapped charge in the trapped charge region.