A semiconductor device includes plural electrode pads arranged in an active region of a semiconductor chip, and wiring layers provided below the plural electrode pads wherein occupation rates of wirings arranged within the regions of the electrode pads are, respectively, made uniform for every wiring layer. The micro-comparator includes an input from an antenna of a receivertransceiver system; a transistor pair; reset transistor; cascaded inverters; an inverter circuit; a buffer; and a D flip flop circuit. Metrology data from the processed semiconductor device is acquired. The processor collects time series of amplified electric field and magnetic signals over a predetermined period of time.