A semiconductor wafer processing system including a multi-chamber module having vertically-stacked semiconductor wafer process chambers and a loadlock chamber dedicated to each semiconductor wafer process chamber. The substrate has microporosity, nanoporosity, or free volume and is a polymer matrix, a metal-organic framework, a micro-porous structure, or a nano-porous structure. When movement timing of the nip rollers overlap, a pulse motor for moving the nip rollers is successively driven. and below a temperature at which thermal decomposition of the calcium phosphate occurs. The panels extend at least partially around, and at least partially define, a cavity of the container. Information is received by such a terminal from the card wirelessly, and also from the magnetic stripe, and the data received contactlessly is preferably used to verify that read from the stripe.