The present invention provides an inbred corn line designated HDI4942, methods for producing a corn plant by crossing plants of the inbred line HDI4942 with plants of another corn plant. A plurality of gate patterns are provided, each gate pattern being between a neighboring lower interlayer dielectric layer and a neighboring upper interlayer dielectric layer. The context specifies where data for this user should be sent. The first hinge is mounted on the connecting boards. The ejector pins are arranged so as to be symmetrical with respect to the tapered positioning pin. There can be provided a resist composition for lithography capable of decreasing occurrences of defects such as coating defects and pattern defects.