A semiconductor package and a fabrication method thereof are provided in which a dielectric material layer formed with a plurality of openings is used and a solder material is applied into each of the openings. Depending on interference conditions, flexible resource reuse may be implemented to mitigate interference without unduly taxing resources. The negotiators answer predefined questions regarding a proposed transaction in such a manner that certain aspects of the transaction can be agreed upon early during the negotiation process while others are deferred to later phases. Another aspect of the invention is improved alignment tolerance of the bit line contact plug.