A method and apparatus is provided that pertains to resisting crack initiation and propagation in electrical interconnections between components and substrates in ball grid array microelectronic packages. By varying the cut-score depths depending on the orientation of the plastic material, greater consistency in the tearability of the individual cells is achieved. A method for installing a convertible electrical device cover is also disclosed including placing the convertible electrical device cover in an operative position over an electrical device so that an adapter plate may be located between the electrical device and a rear side of a base plate. In one of its embodiments the invention provides a voltage indicator circuit that includes, in series, blade 102 and hand guard 104 of bayonet or knife 100, resistor 106, light bulb 108 such as a neon bulb, and electrical thumb terminal 110 embedded in insulating handle 112. 5% tungsten, less than about 1% of one or more of elements selected from a group consisting of carbon, boron, zirconium, yttrium, hafnium, and silicon, and a balance of nickel.