A semiconductor device comprising a semiconductor chip having an active and a passive surface; the active surface includes an integrated circuit and inputoutput pads suitable for metallurgical contacts. The front-edge delay circuit delays a front edge of an input signal input via the input terminal, the back-edge delay circuit delays a back edge of the input signal, and the amplifying circuit amplifies a drive control signal obtained through the front-edge delay circuit and the back-edge delay circuit. The surface texture is formed by a direct, angled ion mill performed on the surface of the magnetic layer while holding the wafer on a stationary chuck. This method and auction system provides a means for borrowers and lenders of securities to meet more efficiently, to trade at a better price, to trade in larger size, to trade more rapidly, and, in some cases eliminate the role of the broker as an intermediary between borrower and lender.