A curing assembly for curing of inks and the like comprises at least one array of UV LEDs 18. In an embodiment of the present invention, the human interface device protocol is encapsulated in Bluetooth baseband protocol for wireless transmission between a peripheral device and a host computer. This substantializes a semiconductor failure analysis apparatus, analysis method, analysis program, and analysis system capable of securely and efficiently carrying out the analysis of the failure of the semiconductor device. Additional mechanisms are also provided for the return of remote resource management to the control of a previously failed, but now recovered node, even if the failure had resulted in a node reset. The system enables background recognition and synchronization of network services in a way that consumes less device power and bandwidth.