An analysis method of designing transmission lines of an integrated circuit packaging board including an integrated circuit chip, a printed circuit board, and an interposer disposed between the integrated circuit chip and the printed circuit board. A portion of the first wall is joined to the second wall wherein the portion includes an off-center opening. Before pressure is applied, the boundary between the two regions is clear. A previous window communicates power indicators reflecting the power of the signal, and a current window communicates current power indicators reflecting the power of the signal. The translucent reflective layer and the reflective layer constitute an optical resonator that causes multiple interference of light. The postponement module postpones the reinitialization of the file server and the serialization information until after the completion rights are terminated.